 2015/09-2020/09，博士， UCSB ：电子工程/Electrical & Computer Engineering
 2015/09-2018/06，硕士， UCSB ：电子工程/Electrical & Computer Engineering
 2011/09-2015/06，本科， 浙江大学竺可桢学院：电子信息工程专业

    邵雷来，上海交通大学长聘教轨助理教授、博士生导师。2011-2015年获得浙江大学（竺可桢学院）电子信息工程学士学位，科研导师为集成电路专家严晓浪教授；

2015-2018年获得加州大学圣芭芭拉分校(UCSB)计算机工程硕士学位；2018-2020年获得加州大学圣芭芭拉分校(UCSB)计算机工程博士学位，师从电子设计自动化(EDA)

领域权威专家郑光廷教授(Kwang-Ting Cheng)；2020-2021 加入Facebook担任数据科学家；2021年9月全职回国加入上海交通大学。

    长期与HP Labs、Facebook、Tencent等工业界实验室保持密切合作，加入交大后专注新型半导体和Chiplet系统的设计工艺协同优化(DTCO/STCO)、柔性电子、

电路设计自动化(EDA)以及机器学习等研究。累计在相关领域的顶级期刊以及会议发表文章20+篇，包括(Nature Communications, IEEE TED, IEEE/ACM Design&Test,

 IEEE/ACM DAC, IEEE DATE, IEEE ASP-DAC), 还获得了EDA领域顶级会议IEEE DATE 2018的Best Paper Award Nominations，谷歌学术累计引用1000+。

    招收硕士、博士研究生和博士后研究员，欢迎感兴趣的同学与我联系！课题组与众多海内外高校都有良好的合作关系，可推荐去交流访问。

 10/2020-07/2021 : Data Scientist, Facebook. Inc.
 05/2020-07/2020 : Data Scientist Intern, Tencent, USA.
 04/2020-06/2020 : Research Intern, HP. Labs.
 06/2019-09/2019 : Data Scientist Intern, Facebook. Inc.
 06/2018-12/2018 : Research Intern, HP. Labs
 06/2017-09/2017 : Research Intern, HP. Labs
 07/2014-09/2014 : Student Research Intern, Harvard University

研究大致分为三个领域：新型器件的大规模集成电路EDA算法研发； 基于柔性电子的人机接口研发； 智能IoT/可穿戴设备的软硬件整合及优化。
 AI4EDA以及在新型半导体大规模集成电路的运用
基于新型器件的特性，研发具有高鲁棒性的大规模集成电路。其中还会涉及新型器件的PDK的建立，高鲁棒性Standard Cell的构建和EDA+ML算法的研发。
 基于柔性电子器件的人机接口研发
人机接口不仅在医疗（穿戴设备），军用（超级士兵）以及商业（VR/AR）中都拥有极其广泛的应用场景。它作为数据在人与计算机的接口扮演者极其重要的角色，它直接影响着数据的质量，设备的可穿戴性以及整体系统的性能。柔性电子拥有者其特殊的优势，它轻薄、廉价以及生物兼容性使得它在众多技术中脱颖而出，然而柔性电子的设计以及整合在当前还没有得到系统的解决。它需要电学特性、机械特性以及生物特性的综合考虑及优化。
 可穿戴设备的软硬件整合及优化
可穿戴设备的核心除了构建高质量的信号采集前端，另外一个重点就是怎么有效的利用采集到的数据和人工智能进行决策。前端采集信号的质量和人工智能决策的效果有着非常强的关联性，所以软硬件整合对于下一代智能IoT与可穿戴设备是不可或缺的。其中会涉及到基于新型器件前端的设计（传感器，放大器以及采样电路等），传感器信号的清洗和处理，以及人工智能模型的建立和优化。

2024-2027 “先进计算芯片的系统-工艺协同设计（STCO）方法研究”国家重点研发计划（参与）

2023-2026 “工艺—器件—电路协同设计（DTCO）方法”国家重点研发计划（主持课题，课题负责人）
2022-2025 上海市“科技创新行动计划”启明星项（杨帆专项）

Journal

-2025 Shao, L., Ogras, U. Y., Tong, G., McFarlane, N., & Nathan, A.，“Cross Society Special Issue (IFETC & ISCAS) on Flexible Hybrid Electronics: Advancing Next-Generation Applications”, IEEE Journal on Flexible Electronics, 3(12), 524-525.

-2025 Ma, T., Fan, G., Sun, X., Deng, Z., Low, K. and  Shao, L. , "Graph Neural Network Based Cell Library Characterization Method for Fast Design Technology Co-Optimization", Integration, the VLSI Journal，唯一通讯.

-2024 Fan, G., Ma, T., Sun, X.,  Shao, L.   and Low, K. ,"Graph Attention Network-Based Unified TCAD Modeling Enabling Fast Design Technology Co-Optimization through Transfer Learning", IEEE Transactions on Electron Devices (TED), 共同通讯.

-2021 Bonnassieux, Yvan, et al. "The 2021 flexible and printed electronics roadmap." Flexible and Printed Electronics 6.2 (2021): 023001.-2020  Tsung‐Ching Huang, Ting Lei, Leilai Shao, Sridhar Sivapurapu, Madhavan Swaminathan, Zhenan Bao, Kwang‐Ting Cheng, Raymond Beausoleil., “Process design kit and design automation for flexible hybrid electronics” in Journal of the Society for Information Display.
-2019  Lei, T., Shao, L. (Co-first), Zheng, Y., Pitner, G., Fang, G., Zhu, C., Li, S., Huang, Beausoleil, R., Wong, H. - S., Huang, T. - C., Cheng, K. - T., and Bao, Z. “Low-voltage High- performance Flexible Digital and Analog Circuits based on Ultrahigh-purity Semiconducting Carbon Nanotubes”, in Nature Communication.
-2019  Shao, L., Huang, T. - C., Lei, T., Chu, T.-Y., Bao, Z., Beausoleil, R., Wang, M. and Cheng, K. - T., “Compact Modeling of Thin Film Transistors for Flexible Hybrid IoT Design”, in IEEE Transaction of Design & Test.
-2017  Ting Lei, Ming Guan, Jia Liu, Hung-Cheng Lin, Raphael Pfattner, Leo Shaw, Allister F McGuire, Tsung-Ching Huang, Leilai Shao, Kwang-Ting Cheng, Jeffrey B-H Tok, Zhenan Bao., “Biocompatible and totally disintegrable semiconducting polymer for ultrathin and ultralightweight transient electronics” in Proceedings of the National Academy of Sciences.

Conference

-2025 Gou, Y., Sun, X.,  Shao, L. and Zhu, X. , "Low Power and High Efficiency Power Management Circuits Based on Flexible LTPO Technologies for Wearable Applications", accepted in 2025 IEEE International Symposium on Circuits and Systems (ISCAS), London, United Kingdom, 2025.

-2024 Ma, T., Fan, G., Sun, X., Deng, Z., Low, K. and  Shao, L. * , "Late Breaking Results: Fast System Technology Co-Optimization Framework for Emerging Technology Based on Graph Neural Networks", 61st Design Automation Conference  (DAC, CCF-A) , 唯一通讯.

-2024 Duan, Y., Liu, X., Yu, Z., Wu, H., Shao, L.*and Zhu, X.*,"RLPlanner: Reinforcement learning based floorplanning for chiplets with fast thermal analysis.", Design, Automation \& Test in Europe Conference & Exhibition  (DATE, CCF-B), 共同通讯.

-2024 Ma, T., Deng, Z., Sun, X. and  Shao, L.*, "Fast Cell Library Characterization for Design Technology Co-Optimization Based on Graph Neural Networks.", in Asia and South Pacific Design Automation Conference (ASP-DAC), 唯一通讯.

-2024 Ma, T., Fan, G., Sun, X., Deng, Z., lu Low, K. and Shao, L.*," Fast Design Technology Co-Optimization Framework for Emerging Technology with Hierarchical Graph Embedding", In 2024 2nd International Symposium of Electronics Design Automation (ISEDA) (pp. 654-659). IEEE, 唯一通讯.

-2024 Deng, Z., Duan, Y., Shao, L.* and Zhu, X. *, "Chiplet placement order exploration based on learning to rank with graph representation", In 2024 2nd International Symposium of Electronics Design Automation (ISEDA) (pp. 605-610). IEEE, 共同通讯.

-2023 Ma, T., Deng, Z. and Shao, L. * , "AutoFlex: Unified Evaluation and Design Framework for Flexible Hybrid Electronics", in Asia and South Pacific Design Automation Conference (ASP-DAC), 唯一通讯.

-2021 Shao, L. and Cheng, K. - T., “High-fidelity and Large-area Flexible Hybrid Sensing System”,  in 2021 IEEE International Conference on Flexible and Printable Sensors and Systems FLEPS.
-2020 Shao, L., Lei, T., Huang, T. - C., Bao, Z., and Cheng, K. - T., “Robust Design of Large Area Flexible Electronics via Compressed Sensing”, in 57th Design Automation Conference (DAC).
-2019 Shao, L., Li, S., Lei, T., Huang, T. - C., Beausoleil, R., Bao, Z., and Cheng, K. - T., “Ultra-thin Skin Electronics for High Quality and Continuous Skin-Sensor-Silicon Interfacing”, in 56th Design Automation Conference.
-2018  Shao, L., Lei, T., Huang, T. - C., Beausoleil, R., Bao, Z., and Cheng, K. - T., “Compact Modeling of Carbon Nanotube Thin Film Transistors for Flexible Circuit Design”, Best Paper Awards Nomination, in Design, Automation and Test in Europe (DATE), Dresden, Germany.
-2018 Shao, L., Lei, T., Huang, T. - C., Beausoleil, R., Bao, Z., and Cheng, K. - T., “Process Design Kit for Flexible Hybrid Electronics”, (Invited paper) in in 23rd Asia and South Pacific Design Automation Conference (ASP-DAC).
-2017 Huang, T. - C., Shao, L., Lei, T., Beausoleil, R. G., Bao, Z., and Cheng, K. - T. Tim, “Robust Design and Design Automation for Flexible Hybrid Electronics”, in International Symposium on Circuits and Systems (ISCAS).